• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to the calibration of a component mounting device which is set up for the mounting of components on a substrate whose mounting locations do not contain any local markings. The substrate contains either global edge markings attached to its edge or other global features that can be used to assemble the devices. Calibration takes place by means of a calibration plate (1) which has a plurality of calibration positions (2) distributed over the calibration plate (1) in two dimensions and provided with first optical markings, a test chip having second optical markings, and a holder attached to the bonding station the temporary recording of the calibration plate (1). The number and arrangement of the calibration positions (2) of the calibration plate (1) and the number and arrangement of the mounting locations of the substrate are - apart from possible exceptional cases - different from each other.
    公开号:CH715039A2
    申请号:CH5922019
    申请日:2019-05-03
    公开日:2019-11-29
    发明作者:Handlos Harald；speer Florian；Stuerner Jürgen
    申请人:Besi Switzerland Ag；
    IPC主号:
    专利说明:

    Description Technical Field The invention relates to a method for calibrating a component mounting device, also known as a device for mounting components.
    Background of the Invention Such component mounters are known in the semiconductor industry as die bonders or as pick and place machines. A "die" is a component. The components are in particular electronic, optical, micromechanical, micro-optical or electro-optical components and the like, or also semiconductor chips or flip chips.
    BRIEF DESCRIPTION OF THE INVENTION The object of the invention is to develop a component mounting device with which a large number of components are positioned precisely on a large-area substrate which has substrate markings or other global features only at its edge, which are used for the positioning can be placed. Such large-area substrates are, for example, wafers with a diameter of 12 inches or more. Other substrates are printed circuit boards, ceramic substrates, sheet metal carriers, panels and the like. Such panels have dimensions of 0.6 m x 0.7 m, for example, or more.
    The above object is achieved according to the invention by a method having the features of claim 1.
    The invention accordingly relates to a method for calibrating a component mounting device. The component mounting device comprises a bonding station and at least one bonding head for placing components on the mounting locations of a substrate, a first camera and a second camera. The first camera is used to record an image of the component or test chip picked up by the bonding head and to determine the deviation of the actual position of the component or test chip from its target position. The second camera is used on the one hand in assembly operation to determine global substrate position data that characterize the position and orientation of the substrate, and on the other hand during calibration to determine the deviation of the actual position of the test chip mounted on a calibration plate from its target position.
    The component mounting device further comprises a transport device that transports one substrate after the other to the bonding station, where it is equipped with components. The bond station includes a pick and place system that moves the bondhead or bondheads to the assembly locations of the substrate. In order to achieve high placement accuracy, the component mounting device is advantageously set up in such a way that the transport device transports the substrate to the bonding station and then the substrate is held in place at the same place during the entire assembly process. In this case, the working area of the bondhead or bondheads is as large as or larger than a substrate.
    Since the individual mounting locations of the substrates do not contain any markings that define its position, the position of the respective mounting location that the bondhead has to approach in order to mount a component is calculated on the basis of global substrate position data that determine the location and orientation of the substrate characterize. The global substrate position data are determined either on the basis of substrate markings attached to the edge of the substrate or, if the substrate does not have any substrate markings, on the basis of special global features of the substrate, such as “flat” and / or “notch” for a wafer, etc., as soon as the substrate was transported to the bond station and fixed there.
    In order to ensure that the position approached by the bondhead matches the position calculated for the assembly location, the component assembly device is calibrated. Calibration data are determined during calibration. The calibration is carried out by means of a holder, a calibration plate, which has a large number of calibration positions, and one or more test chips. The calibration positions of the calibration plate are distributed two-dimensionally over the calibration plate, for example they are arranged in rows and columns. The calibration positions of the calibration plate and the test chip (s) contain matching first and second optical markings.
    The holder for receiving the calibration plate is either stationary or detachable in the bond station of the component mounting device. The component mounting device and the holder are designed such that the calibration data completely cover the working area of the bondhead or bondheads. Either a single calibration plate can be used, which covers the entire working area, or the holder can be set up to receive the calibration plate in succession in different positions, with which the entire working area is covered. The working area and thus the area covered by the calibration data is advantageously as large as or larger than an entire substrate, so that the substrate can remain fixed in the same place during the entire assembly process.
    During the calibration, a single test chip or several test chips is placed at a number of selected calibration positions and the deviation of the actual position of each set test chip from its target position
    CH 715 039 A2 with the help of the two cameras and also available image processing hardware and software. The deviation is preferably determined immediately after the test chip has been removed. The deviation can be represented by a difference vector v with at least two components, for example with two components v = (x, y) or with three components v = (x, y, θ), component x being a displacement in a first direction and the Component y denotes a displacement in a second direction and component θ is an angle that denotes a twist around a center. A difference vector v with two components is often sufficient, namely when the angular deviation θ is so small that no disturbing position error results.
    The number of selected calibration positions can be increased adaptively during the method, for example if the detected difference vectors indicate a non-linear behavior of the axes of movement of the bondhead or bondheads.
    The holder is preferably set up to hold the calibration plate by means of vacuum and the holder and the calibration plate are preferably set up to fix the test chip by means of vacuum. The holder and the calibration plate can also be set up to hold the calibration plate magnetically. Likewise, the holder and / or the calibration plate and the test chip can be set up to magnetically fix the test chip.
    In another embodiment, the holder consists only of position pins, which are preferably permanently attached to the bond station. In this case, there is no need to insert the holder for calibration and remove it later. Such a holder cannot hold the calibration plate, but only position it.
    [0014] The calibration plate is preferably a glass plate and the test chip is preferably a glass chip. The first and second optical markings are preferably structures made of chrome, since such structures can be produced with extremely high accuracy. These structures are not optically transparent.
    The determination of the calibration data comprises, for example, the following steps:
    A) positioning the calibration plate in the holder of the bond station and / or fixing the calibration plate on the holder of the bond station;
    B) Perform the following steps C to I for a number of calibration positions present on the calibration plate:
    C) holding a test chip with the bond head,
    D) taking a picture of the test chip held by the bondhead with the first camera and determining the deviation of the actual position of the test chip from its target position,
    E) calculating the position to be approached by the bondhead for placing the test chip at the calibration position,
    F) moving the bondhead to the calculated position and placing the test chip on the calibration plate,
    G) taking a picture of the test chip placed on the calibration plate with the second camera,
    H) Determining a difference vector v which describes a deviation of the actual position of the test chip from its target position.
    The difference vector v is a zero vector if no deviation has been determined. The test chip or the test chips are each removed again at a suitable time after step G. Of course, the same test chip can always be used. The calibration can be refined by repeating all or some selected steps C through H one or more times to obtain additional difference vectors v.
    After all or some of the steps C to H have been carried out once or several times, one or more difference vectors are available for each calibration position. Therefore, the step follows:
    I) assigning correction data, which are based on at least one difference vector v, to the calibration position.
    The following applies to step I of each calibration position used: If steps C to H have only been carried out once, then the correction data of the calibration position contain the one difference vector v. If some of the steps C to H have additionally been carried out one or more times, then there are several difference vectors v. The correction data can then contain, for example, all or only a few difference vectors v selected according to certain criteria, or the correction data can alternatively contain a correction vector which has been calculated from all or a few selected difference vectors v.
    If the component mounting device has more than one bondhead, then the above procedure for the work area is performed by each of the bondheads.
    CH 715 039 A2 If the dimensions of the calibration plate are too small to cover the entire working area of the bondhead or bondheads, then the calibration plate is attached to the holder in different positions and the calibration procedure described above is carried out for each position. The various positions are designed so that they cover the entire working area of the bondhead or bondheads.
    [0021] After the calibration has been carried out, calibration data are available which comprise the calibration positions used and the correction data assigned to these calibration positions. The calibration positions are defined by a vector w with at least two components, for example with two components w = (w1, w2) or with three components w = (w1, w2, φ), the component w1 being the position in a first direction and the Component w2 designate the position in a second direction and component φ is an angle that designates the rotation about a center. The calibration data thus comprise a vector w and correction data for each of the calibration positions used.
    The number and arrangement of the calibration positions of the calibration plate 1 and the number and arrangement of the mounting locations of the substrate are - apart from possible exceptional cases - different from each other.
    In a component mounting device in which the substrate is transported from the transport device to the bond station and fixed there - for example by suction with a vacuum - then fitted with the components and then transported away from the bond station, the calibration data cover an area that is as large as or larger than a substrate.
    After calibration, the assembly of the components on the assembly sites of the substrate can be carried out with the following steps:
    Transporting the substrate to the bonding station and fixing the substrate;
    Determining global substrate position data that characterize the location and orientation of the substrate;
    and assembling one component after another on one assembly site of the substrate after another by the following steps:
    with the at least one bonding head receiving a component from a supply unit;
    taking a picture of the component held by the bondhead with the first camera and determining the deviation of the actual position of the component from its target position;
    Calculating the actual position of the assembly site based on the global substrate position data;
    Calculating a correction vector to be used for the assembly site on the basis of selected calibration data; Calculating the position to be approached with the bondhead; and
    Move the bondhead to the calculated position and deposit the component on the substrate.
    DESCRIPTION OF THE FIGURES The invention is explained in more detail below using an exemplary embodiment and the drawing. The figures are schematic and are not drawn to scale.
    1 shows a calibration plate suitable for calibration of the component mounting device with a large number of calibration positions,
    2 shows an enlarged view of a calibration position of the calibration plate,
    3 shows a test chip,
    4 and 5 show in top view and in cross section a holder for the calibration plate,
    6 shows parts of a component mounting device necessary for understanding the invention, and
    7 shows a test chip placed on the calibration plate.
    A bond station of a component mounting device is designed with a stationary holder or for the temporary holding of a holder which receives and holds a calibration plate. The calibration plate is a highly stable support with extremely precisely defined calibration positions, which are arranged two-dimensionally over the entire calibration plate, especially in rows and columns. The calibration plate and the test chips are preferably made of glass, since glass is transparent and has excellent mechanical and optical properties for this application.
    The holder is advantageously set up to temporarily hold the calibration plate and the test chip (s). In a preferred embodiment, each calibration position of the calibration plate is formed with a bore which can be subjected to a vacuum in order to fix the test chip (s) with vacuum. The vacuum is supplied by a vacuum source. In an alternative embodiment, the holder and / or the calibration plate and the test chips are provided with magnets and optionally ferromagnetic elements, so that magnetic forces cause the test chip (s) to adhere to the calibration plate.
    CH 715 039 A2 [0028] FIG. 1 shows a top view of a calibration plate 1 suitable for the calibration of the component mounting device, here a glass plate. The calibration plate 1 shown contains a large number of calibration positions 2 arranged in rows and columns. FIG. 2 shows such a calibration position 2 of the calibration plate 1 in an enlarged view. Each calibration position 2 contains first optical markings 3. In this exemplary embodiment, each calibration position 2 also contains a bore 4 which passes through the calibration plate 1 in order to hold the test chip (s) in a vacuum. The bore 4 is preferably arranged in the center of the respective calibration position 2.
    3 shows a test chip 5. The test chip 5 is optically transparent and contains various second optical markings 6. The test chip 5 is preferably made of glass.
    The first optical markings 3 of the calibration plate 1 and the second optical markings 6 of the test chip 5 are preferably structures made of chrome and thus not optically transparent.
    The first optical markings 3 attached to the calibration plate 1 and the second optical markings 6 attached to the test chip 5 each contain, for example, five rings 7 and 8, the diameter of the rings 7 of the calibration plate 1 being different from the diameter of the rings 8 of the test chip 5. The mutual spacing of the center of the rings in the calibration plate 1 is the same as in the test chip 5, so that when the test chip 5 is correctly positioned in the calibration position 2, the rings 7 of the calibration plate 1 run concentrically with the rings 8 of the test chip 5 and are spaced apart from them and are therefore optically distinguishable. The first optical markings 3 and the second optical markings 6 can additionally comprise scales or verniers, as shown.
    4 and 5 show in top view and in cross section an embodiment of a holder 9, which is designed according to the invention, first to hold the calibration plate 1 with vacuum and second to apply the bores 4 of the calibration plate 1 with vacuum. The holder 9 has a flat surface 10 on which the calibration plate 1 can be placed. The flat surface 10 can have a protruding peripheral edge. The surface 10 is provided with first bores 12 which open into a first chamber 11 which is arranged below the surface 10 and can be acted upon by vacuum. The first bores 12 are arranged such that they are aligned with the bores 4 of the calibration plate 1, so that the test chips placed on the calibration plate 1 are held in place with a vacuum. The surface 10 also contains second bores 13 which open into a second chamber or groove of the holder 9 which can be acted upon by vacuum in order to also fix the calibration plate 1 to the holder 9 using a vacuum. The first chamber 11 can also be divided into several individual chambers, which can be acted upon separately by vacuum. With such a subdivision, it is possible to reduce the vacuum consumption if necessary.
    In another embodiment, the holder consists only of position pins, which are preferably permanently attached to the bond station. In this case, there is no need to insert the holder for calibration and remove it later. Alternatively, the position pins could be temporarily inserted into the bond station for the calibration and removed again after the calibration. Such a holder cannot hold the calibration plate, but only position it, and since it consists only of position pins, it also has no flat surface. In this embodiment, neither the holder nor the test chips are held in a vacuum.
    Fig. 6 shows schematically the parts of a component mounting device required for understanding the invention. The bond station 17 of the component mounting device comprises a pick and place system with at least one bonding head 14, which places the components on a substrate. Various substrates are used as the substrate. The substrates are transported from a transport device to the bond station 17 and away from the bond station 17. The holder 9 is arranged in the bond station 17. The holder 9 is preferably fastened interchangeably, since it is typically only required for the calibration of the component mounting device. The component mounting device comprises a first camera 15 and a second camera 16, as well as image processing hardware and software. The first camera 15 serves in assembly operation to deviate the actual position of the component picked up by the bondhead 14 from its target position or, during calibration, the deviation of the actual position of the test chip 5 picked up by the bondhead 14 from its target position determine. The second camera 16 serves on the one hand to determine the global substrate position data which characterize the position and orientation of the substrate in assembly operation and on the other hand during the calibration to determine the deviation of the actual position of the test chip 5 placed on the calibration plate 1 from its target Determine location. There are component mounts in which the second camera 16 is fixedly or slidably attached to the bond station 17, and there are component mounts in which the second camera 16 is attached to the bondhead 14. The first camera 15 is located below the travel path of the bonding head 14 and sees the component or the test chip 5 from below. The second camera 16 is located above the holder 9, so that the substrate or the calibration plate 1 is in its field of vision. The holder 9 is preferably black so that it only appears as a black background in the images of the second camera 16 and thus does not influence the image processing.
    6, the holder 9, the calibration plate 1 and a test chip 5 are shown, which are used during the calibration. In regular assembly operations, the substrate is at the position of the calibration plate 1 and a component is at the position of the test chip 5.
    CH 715 039 A2 The method for the calibration of the component mounting device uses the above-mentioned means - calibration plate 1, holder 9 for the calibration plate 1, and bond head 14, cameras 15, 16 and the image processing hardware and software and comprises the following steps :
    A) positioning the calibration plate 1 in the holder of the bond station 17 and / or fixing the calibration plate 1 on the holder 9 of the bond station 17;
    B) Performing the following steps C to I for a number of calibration positions 2 present on the calibration plate 1:
    C) receiving a test chip 5 with the bonding head 14,
    D) with the first camera 15 taking an image of the test chip 5 held by the bonding head 14 and determining the deviation of the actual position of the test chip 5 from its target position,
    E) calculating the position to be approached by the bonding head 14 for the placement of the test chip 5 at the calibration position 2,
    F) moving the bondhead 14 to the calculated position and placing the test chip 5 on the calibration plate 1,
    G) taking a picture of the test chip 5 placed on the calibration plate 1 with the second camera 16,
    H) Determination of a difference vector v, which describes a deviation of the actual position of the test chip 5 from its target position.
    After all or some of the steps C to H have been carried out once or several times, one or more difference vectors are available for each calibration position. Therefore, the step follows:
    I) assigning correction data, which are based on at least one difference vector v, to the calibration position.
    The correction data from each calibration position contain, for example, all or only a few difference vectors v selected according to certain criteria, or the correction data can alternatively contain a correction vector which was calculated from all or a few selected difference vectors v.
    The position to be approached by the bonding head 14 in step E is calculated on the basis of the actual position of the selected calibration position and the deviation of the actual position of the test chip 5 from its target position determined in step D. The actual position of the selected calibration position 2 can be determined either on the basis of global markings, which are arranged, for example, in the edge region of the calibration plate 1, or on the basis of local markings, which are arranged in the region of the selected calibration position 2. In the second case, the following step can be carried out between the two steps D and E: take a picture of the selected calibration position 2 with the second camera 16 and determine the actual position of the selected calibration position 2.
    7 shows an image recorded by the camera 15 of a test chip 5 placed at the selected calibration position 2 of the calibration plate 1. The image shows both the first optical markings 3 of the calibration plate and the second optical markings 6 of the test chip 5 visible. The image processing hardware and software of the component mounting device is set up to determine the actual position of the optical markings 6 of the test chip 5 relative to the actual position of the optical markings 3 of the calibration plate 1 and from this the deviation of the actual position of the test chip 5 from it Determine target position.
    The calibration plate 1 is fixed to the bonding station 17 in that the said holder 9 is inserted at the intended location and the calibration plate 1 is placed on the holder 9 and fixed with vacuum or magnetically.
    The determination of the actual position of the test chip 5 or the calibration position 2 or the determination of the deviation of the actual position of the test chip 5 from its target position from the respective image is carried out by means of the image processing hardware and software of the component mounting device ,
    Because the test chip 5 is transparent, both the optical markings 6 of the test chip 5 and the optical markings 3 of the calibration position underneath are visible in the image recorded by the second camera 16.
    If the holder 9 is formed with a single first chamber 11, then of course the bores 12 of all calibration positions 2 are subjected to a vacuum at the beginning of the test method. If the holder 9 is formed with a plurality of chambers, then vacuum is applied to one chamber after the other and a test chip 5 is placed in the calibration position assigned to the vacuumed chamber. There can be one
    CH 715 039 A2
    Test chip 5 can be used. In this case, the bonding head 14 places this test chip 5 one after the other on each of the selected calibration positions 2 of the calibration plate 1 in accordance with the above-mentioned method. The number of calibration positions 2 used can include all calibration positions 2 of the calibration plate 1 or only a few selected calibration positions 2 of the calibration plate 1 , The test chip or the test chips 5 can also be placed several times on the selected or all calibration positions 2.
    In normal operation of the component mounting device, components with high positional accuracy can now be placed on the substrate locations of a substrate, namely with the steps
    A2) transporting the substrate to the bonding station 17 and fixing the substrate to the bonding station 17;
    B2) determining global substrate position data;
    C2) and assembly of one component after another on one assembly site of the substrate after the other through steps D2 to H2:
    D2) with the bondhead 14 or one of the bondheads picking up a component from a feed unit;
    E2) with the first camera 15 taking an image of the component held by the bonding head 14 and determining the deviation of the actual position of the component from its target position,
    F2) calculating the actual position of the assembly site based on the global substrate position data;
    G2) calculating the position to be reached with the bonding head 14; and
    H2) moving the bondhead 14 to the calculated position and depositing the component on the substrate.
    [0046] The global substrate position data characterize the position and orientation of the substrate and thus also the position and orientation of the assembly locations. The determination of the global substrate position data in step B2 takes place either on the basis of substrate markings attached to the edge of the substrate or, if the substrate has no substrate markings, on the basis of special, global characteristics of the substrate. If the substrate is a wafer, then global features such as “flat” and / or “notch” of the wafer are used for this purpose. To determine the global substrate position data, one or more images of the substrate markings or the special features of the substrate are recorded with the second camera 16 and the position of the substrate with respect to the machine coordinates of the bonding head 14 or the bonding heads 14 is determined using the image processing hardware and software.
    The calculation of the actual position (which also includes its orientation) of the assembly site in step F2 is based on the global substrate position data.
    The calculation of the position to be approached with the bondhead in step G2 takes place on the basis of the deviation of the actual position of the component picked up by the bondhead from its desired position, the actual position of the assembly location calculated in step F2 and a correction vector , which is determined on the basis of selected calibration data. The number and arrangement of the calibration positions of the calibration plate 1 and the number and arrangement of the mounting locations of the substrate are - apart from possible exceptional cases - different from one another. The correction vector to be used for the assembly location is therefore advantageously calculated using an interpolation method which calculates the correction vector to be used on the basis of selected calibration data, the selected calibration data one or more calibration positions surrounding the current assembly location and the correction data relating to the one calibration position or are assigned to the plurality of calibration positions.
    In a component mounting device in which the substrate is transported from the transport device to the bond station 17 and fixed there, then equipped with the components and then transported away from the bond station 17, the calibration data cover an area as large as or larger than a substrate.
    The method according to the invention can also be used to test the positional accuracy or the validity of the calibration of the component mounting device under long-term effects such as temperature changes, changes in air humidity, etc., since the placement of the test chip (s) 5 on the calibration positions 2 can be carried out for long periods, for example for a whole night, without the need for manual work, for example cleaning the calibration plate 1.
    The inventive method can be used for the assembly of substrates of any size, although it has been developed for large-area substrates. The method can also be used if the substrates contain local markings.
    权利要求:
    Claims (4)
    [1]
    claims
    1. A method for calibrating a component assembly device, the component assembly device comprising a bond station (17) and at least one bond head (14) for placing components on assembly sites
    CH 715 039 A2
    Substrate, a first camera (15) and a second camera (16), wherein the assembly of the components on the assembly sites of the substrate comprises the following steps:
    Transporting the substrate to the bonding station (17) and fixing the substrate;
    Determining global substrate position data that characterize the location and orientation of the substrate; and assembling one component after another on one assembly site of the substrate after the other by the following steps: with the at least one bonding head (14) receiving a component from a feed unit;
    with the first camera (15) taking an image of the component held by the bonding head (14) and determining the deviation of the actual position of the component from its target position;
    Calculating the actual position of the assembly site based on the global substrate position data;
    Calculating a correction vector to be used for the assembly site on the basis of selected calibration data; Calculating the position to be approached by the bonding head (14); and
    Moving the bondhead (14) to the calculated position and depositing the device on the substrate; and wherein the calibration comprises the determination of calibration data with the following steps:
    Positioning a calibration plate (1) in a holder (9) of the bond station (17) and / or fixing a calibration plate (1) on a holder (9) of the bond station (17), the calibration plate (1) being two, two-dimensional, over the calibration plate (1) distributed calibration positions (2) provided with first optical markings (3); Perform the following steps for a number of calibration positions (2):
    with the bondhead (14) recording a test chip (5) which has second optical markings (6), with the first camera (15) recording an image of the test chip (5) held by the bondhead (14) and determining the deviation of the actual Position of the test chip (5) from its target position,
    Calculating the position to be approached by the bondhead (14) for placing the test chip (5) at the calibration position (2),
    Moving the bondhead (14) to the calculated position and placing the test chip (5) on the calibration plate (1), with the second camera (16) taking an image of the test chip (5) placed on the calibration plate (1), determining a difference vector , which describes a deviation of the actual position of the test chip (5) from its target position; Assigning correction data based on at least one difference vector to the calibration position, the calibration data comprising the calibration positions used and the correction data assigned to them.
    [2]
    2. The method according to claim 1, characterized in that the individual assembly locations of the substrates do not contain any markings.
    [3]
    3. The method according to claim 1 or 2, characterized in that the number and arrangement of the calibration positions used in the calibration and the number and arrangement of the mounting locations of the substrate are different from one another, and that the calculation of the correction vector to be used for the mounting location by means of an interpolation method takes place, which calculates the correction vector to be used on the basis of selected calibration data, which comprise one or more calibration positions which surround the current assembly location and the correction data which are assigned to the one or more calibration positions.
    [4]
    4. The method according to any one of claims 1 to 3, characterized in that the substrate remains fixed during the assembly of the components and that the calibration data cover an area which is as large as or larger than a substrate.
    CH 715 039 A2
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    同族专利:
    公开号 | 公开日
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    KR20190135422A|2019-12-06|
    US20190362998A1|2019-11-28|
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    申请号 | 申请日 | 专利标题
    CH6772018|2018-05-28|
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